Research Article

Article:CMOS Development and Optimization, Scaling Issue and Replacement with High-K Material for Future Microelectronics

by  Davinder Rathee, Mukesh Kumar, Sandeep K. Arya
journal cover
International Journal of Computer Applications
Foundation of Computer Science (FCS), NY, USA
Volume 8 - Issue 5
Published: October 2010
Authors: Davinder Rathee, Mukesh Kumar, Sandeep K. Arya
10.5120/1208-1730
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Davinder Rathee, Mukesh Kumar, Sandeep K. Arya . Article:CMOS Development and Optimization, Scaling Issue and Replacement with High-K Material for Future Microelectronics. International Journal of Computer Applications. 8, 5 (October 2010), 10-17. DOI=10.5120/1208-1730

                        @article{ 10.5120/1208-1730,
                        author  = { Davinder Rathee,Mukesh Kumar,Sandeep K. Arya },
                        title   = { Article:CMOS Development and Optimization, Scaling Issue and Replacement with High-K Material for Future Microelectronics },
                        journal = { International Journal of Computer Applications },
                        year    = { 2010 },
                        volume  = { 8 },
                        number  = { 5 },
                        pages   = { 10-17 },
                        doi     = { 10.5120/1208-1730 },
                        publisher = { Foundation of Computer Science (FCS), NY, USA }
                        }
                        %0 Journal Article
                        %D 2010
                        %A Davinder Rathee
                        %A Mukesh Kumar
                        %A Sandeep K. Arya
                        %T Article:CMOS Development and Optimization, Scaling Issue and Replacement with High-K Material for Future Microelectronics%T 
                        %J International Journal of Computer Applications
                        %V 8
                        %N 5
                        %P 10-17
                        %R 10.5120/1208-1730
                        %I Foundation of Computer Science (FCS), NY, USA
Abstract

The development and optimization of Silicon technology has been guided by CMOS scaling theory [1] and predications made by Semiconductor Industry (SIA) in the International Technology Roadmap for Semiconductor (ITRS). With the trend of scaling down of Complementary Metal Oxide Semiconductor (CMOS) transistors with Moore’s Law [2] requires replacement of conventional silicon dioxide layer with the higher permittivity material for gate dielectric. As the silicon industry moves to 32nm technology node and beyond complaints like leakage and power dissipation dominates. Managing such issues are crucial factors for reliable high speed operation and chip design. Although scaling will continue for couple of decades but device geometries reaches to atomic size and limitation of quantum mechanical physical boundaries. To address these problems there is need of innovation in material science & engineering, device structure, and new nano devices based on different principle of physics. Here we have elaborated about scaling issues and alternate high-k dielectric for Metal Oxide Semiconductor Field Effect Transistor (MOSFET). Introducing a high-k material may replace today’s silicon dioxide technology and can also provide extendibility over several generations. C-V analyses have been studied for various MOS capacitor with conventional SiO2 and also with high-k material like Gd2O3, ZrO2, HfO2, and TiO2.

References
  • D.Rathee, et al, proc. Of National Conference ITM, oct6(2007)82-87
  • G.Moore, IEDM Tech., Dig. (1975)
  • H.Iwai, Hei Wong, Microelectronics Engg. 83(2006) 1867-1904
  • http://www.itrs.net
  • B. Doris, et al, IEDM Tech Dig. (2002) 267.
  • H.S.P Wong, et al, Proc. IEEE 87 (1999) 537
  • D.Frenk, et al, Proc. IEEE 89 (2001) 259.
  • H.Iwai Microelectronics Engg. 86(2009), 1520-1528.
  • Sidda Reddy Kurakulla, M.S in Engg. Thesis, IIS Banglore, oct 27 , 2007.
  • ITRS 2003, Edition, Semiconductor Industry Association (SIA), Austin, SEMATECH USA, 2706 from :http://www.itrs.net/ntrs/publntrs.nsf
  • R Chau, et al, IEEE Electron Device Letter, 25 (2004) 408
  • D.Mullar, et al, Nature, 758(1999) 399
  • M. Radder, et al, IEDM technical Digest, (1998) 623.
  • H.Iwai, Hei Wong, Microelectronics Engg. 83(2006) 1867-1904.
  • H.Iwai, Sc in IEDM,2008.
  • H.Wong,V.A.Gitsenko, Microelectron. Reliab 42(2002)597.
  • K.Tse, et al, Microelectron Engg. 84(2007)2028.
  • S.H.Lo, et al, IEEE Electron devices lett. 18 (1997) 209. a. Kingon, et al, Nature 406 (2000) 1032
  • G.D. Wick, et al, J. of App. Phy 89 (2001) 5243
  • D.Buchanan, IBM J.Res Develop 43(1999) 245
  • L.Manchanda, et al, Idem Technical Digest (1998) 605.
  • E.P.Gusev, et al, Appl. Phy lett 76(2000) 176.
  • M.Copel, et al, Appl. Phy lett 78(2001)2670.
  • D.A. Buchanan, et al, IEDM technical digest (2000)
  • R.Ludeka, et al, Appl. Phy lett 76 (2001)2886
  • M.Coepl, et al, Appl. Phy lett 76(2000)436
  • T.S.Jeon, et al, Appl. Phy lett 78(2001)368
  • W.J, et al, Appl. Phy lett 77(2000)3269.
  • L. kang, et al, IEDM technical Digest (2000)181
  • T.Modes, et al, Surf and coat Tech, 200 (2005)306
  • Sin-iti Kitazawa, et al, Thin Solid Films 515 (2006) 1901.
  • S.Murugesan, et al, Surf and Coat Tech, 201 (2007) 7713
  • Shoujing, et al, jounal of physics series, 152 (2009) 012004
  • D. Buchanan, IBM J.Res\Develop 43(1999)245
  • A.M. Stoneham, Journal of Non-crystlline Solids 303 (2002) 114-122
  • Sin-iti Kitazawa, et al, Thin Solid Films 515 (2006) 1901
  • D. Buchanan, IBM J.Res\Develop 43(1999)245
  • C.Kittel, Introduction to solid state physics 7th edition, john wiely & sons Inc New York (1996)
  • G.D. Wilk, et al, J Appl Phy 89 (2001) 5243
  • J.Rebertson, J Vac Sci B 18 (2000) 1785
  • K Hubbard, D Sehlon, J Matr Reg 11 (1996) 2757
  • Ep Gusev, et al, Appl phy letter 76 (2000) 176
  • G.Lucovsky, et al, springer US (2002) 189.
  • T.Modes, et al, Surf and coat Tech, 200 (2005)306
  • Sin-iti Kitazawa, et al, Thin Solid Films 515 (2006) 1901.
  • S.Murugesan, et al, Surf and Coat Tech, 201 (2007) 7713
  • E.K.Evangelou, et al, J Appl phy 94 (2003) 318
  • E.P.Gusev, et al, IBM research, Microelectronics engg.,59 (2001) 341
  • Anieszka Borkowska, et al, workshop “Photnic and Microsystem”IEEE (2006).
  • K.F. Albertin, et al, Journal of circuits and system v2n2 (2007) 89-93
  • Banani Sen, et al, Solid State Electronics 51 (2007) 475-480
  • Martin M Frank, et al, Microelectronics Engg. 86 (2009).
Index Terms
Computer Science
Information Sciences
No index terms available.
Keywords

Scaling High-k Material oxides

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